

2309408-2
260 Position SODIMM DDR4 SDRAM Socket Surface Mount
Availability: In Stock
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Verification | Issues | Specs | Pricing |
Specifications for the 2309408-2
Part Name | 2309408-2 |
Manufacturer | TE Connectivity |
Centerline (Pitch) | .5 |
Keying | Reverse |
Circuit Application | Power |
Ejector Location | Both Ends |
Housing Material | High Temperature Thermoplastic |
Retention Post Location | Both Ends |
Center Post | Without |
Number of Positions | 260 |
PCB Mount Retention Type | Solder Peg |
Profile | Low |
PCB Mount Retention | With |
Stack Height | 4 |
Center Key | Offset Right |
TE Internal Number | 2309408-2 |
Connector & Contact Terminates To | Printed Circuit Board |
Connector System | Cable-to-Board |
Ejector Type | Locking |
Housing Color | Black |
Insertion Style | Cam-In |
Product Type | Socket |
Connector Mounting Type | Board Mount |
Number of Keys | 1 |
Operating Temperature Range | -55 – 85 |
Packaging Method | Tape & Reel |
Packaging Quantity | 900 |
DRAM Type | Small Outline (SO) |
Contact Mating Area Plating Material | Gold |
Socket Style | SO DIMM |
PCB Mounting Style | Surface Mount |
Contact Base Material | Copper Alloy |
Module Orientation | Right Angle |
SGRAM Voltage (V) | 1.2 |
Socket Type | Memory Card |
UL Flammability Rating | UL 94V-0 |
Latch Material | High Temperature Thermoplastic |
Row-to-Row Spacing | 8.2 |
Contact Current Rating (Max) (A) | .5 |
DRAM Voltage (V) | 1.2 |
Contact Mating Area Plating Thickness | 5 |
列数 | 2 |
PCB Contact Termination Area Plating Material | Gold Flash |
Sealable | No |
Formats Available for Symbols and Footprints |
Altium, Eagle, KiCAD, Cadence OrCad/Allegro, PADS, DxDesigner, PCB123, Pulsonix, Proteus |
Datasheet | See Datasheet PDF |
Inventory for the 2309408-2 by TE Connectivity from major distributors.
Supplier | Quantity | Price | Purchase | |
---|---|---|---|---|
★ Featured
|
3,877
|
|
Visit Site | |
Verical |
9,000
|
450 x $1.23
|
Visit Site |
No issues have been reported for the 2309408-2
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