Altium footprint layers

Hello there, here is what each of the layers in Altium signifies:

1. Top: This is the top layer of the PCB, where the main components are placed and routed.
2. Silkscreen (Top Overlay): This is the layer where component labels, logos, and other non-electrical information are printed. This is typically used for identification and assembly purposes.
3. Soldermask (Top Solder): This layer is used to prevent solder bridging between adjacent pads during soldering process. It is usually represented by the green (or other colors) insulating material that covers most of a PCB.
4. Solder paste (Top Paste): This layer indicates where solder paste should be applied during the assembly process. It's usually used in conjunction with surface mount technology (SMT) components.
5. Keepout (Mechanical 15): This layer is used to define areas where certain components or traces should not be placed. For example, it may be used to prevent placing components too close to the edge of the board.
6. Mechanical Outlines (Mechanical 13): This layer is typically used to draw the physical boundaries of the PCB, including board shape, size, and mounting holes.
7. Cutouts (Mechanical 1): This layer is used to define areas where material should be removed from the PCB, often used for complex board shapes or to create space for components that protrude through the board.
8. Restrict top/bottom and Restrict Vias (Keep-out layer): These are special layers used to prevent certain types of objects (like traces, vias, or components) from being placed in specific areas.

Note that the specific layer numbering (e.g., Mechanical 13, Mechanical 1, Mechanical 15) can vary between different design practices and companies, and the purposes mentioned here may not always apply. Always refer to the specific documentation or guidelines provided with your design files for an accurate understanding of each layer's purpose.