This page outlines the standards we follow at SnapEDA when creating symbols & footprints, and those that we recommend members of our site to follow.
At a high-level, we follow IPC-7351B for footprints (also known as land patterns), and a mix of IEEE-315 for symbols and our own internal standards.
When semiconductor manufacturers provide us with models, we designate the uploader of the model as such. It is more common than not that these models will not follow IPC standards, but rather the manufacturer recommended land patterns.
A big area of focus at SnapEDA is to provide transparency into the quality of models, and hence why we released our patent-pending verification checker. This set of automated checks is available on every single part page and will check for common issues, such as silkscreen to pin overlaps. Please review this before downloading, but also be sure to verify the dimensions yourself to ensure it suits your application and company specific requirements. Learn more about the checker in this blog post.
Finally, we architected SnapEDA to be able to handle various standards and library preferences dynamically, and therefore it is our intent to be able to support more customizability moving forward. Please let us know if you have particular preferences we should be incorporated.
If you have additional ideas on this front or suggested improvements to our standards, please contact us. We'd especially like to hear from companies and standards organizations who are working on standards that we can be adopting and collaborating on.
Please contact us to suggest improvements to these standards.