The footprint has issues.
1. Pins are D shaped.
2. The thermal pad has via’s
3. The paste mask thermal pad is window paned
4. the paste mask layer on the IO pins are oval
5. The IO pins and Thermal is NSMD
Answered 4 years ago.
This footprint follows IPC-7351B standards instead of the manufacturer recommendations.
You can see this by going to the Verification Checker section on the page where it will specify whether we followed IPC standards, or the manufacturer recommendations.
If you'd like this part made to manufacturer's standards, we'd be happy to accommodate. Please contact support in the bottom right-hand corner to coordinate this.