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  • Questions /
  • Question about the Microsemi ZL38051LDG1

Question about the Microsemi ZL38051LDG1

0

I use this part in my designs. This footprint has no thermal pad.

Related Part:   ZL38051LDG1

Added 7 Jahre ago.

W
wildwpe

4 Answers

0

Hello there,

Thanks for reporting this issue, we are going to investigate right now and get back to you

Answered 7 Jahre ago.

admin
Natasha Baker

0

Hello there,

We have fixed the part, you can download it here: https://www.snapeda.com/parts/ZL38051LDG1/Microsemi/view-part/

Thanks!

Answered 7 Jahre ago.

admin
Natasha Baker

0

The footprint has issues.
Microsemi recommends:
1. Pins are D shaped.
2. The thermal pad has via’s
3. The paste mask thermal pad is window paned
4. the paste mask layer on the IO pins are oval
5. The IO pins and Thermal is NSMD

Answered 7 Jahre ago.

W
wildwpe

0

This footprint follows IPC-7351B standards instead of the manufacturer recommendations.

You can see this by going to the Verification Checker section on the page where it will specify whether we followed IPC standards, or the manufacturer recommendations.

If you'd like this part made to manufacturer's standards, we'd be happy to accommodate. Please contact support in the bottom right-hand corner to coordinate this.

Answered 7 Jahre ago.

admin
Natasha Baker

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