IPC-7351A

Thanks for flagging this part! Let me check this with our team and we will get back to you shortly for more updates.

Hello there,

This is Carlos stepping in for Ron, thanks for patiently waiting.

SnapMagic models follow IPC-7351B, which has rectangle pads as one of its basic land shapes offered, which is why we use it for our 2-pad chip packages to maximize area.

However, we understand that adding a corner radius improves solder distribution and fabrication, and we have shared this feedback with our team to enhance our chip packages, which has already been implemented in our latest standard packages.

Thank you for sharing your feedback, and please let us know if you have any other questions, we'd be happy to help!

there seems to be some disagreement with you that IPC-7351B released in 2010 promotes rectangular pads.

https://www.pcblibraries.com/forum/rounded-rectangle-pad-shape_topic1462.html

Clearly this has been known by libraries makers since 2014, 10 years ago.

Then you appear to indicate "everything is ok, thanks for the feedback" and "its been implemented" when I can go to digikey or mouser, ask for any cap/resistor footprint and what you offer is rectangular or in other words, sub-standard. it's not just this part, its every part offered on digikey or mouser.

https://www.digikey.com/en/models/3886660

I have resorted to making my own. Don't be discouraged though, as this is a common experience for me. i look at some major part of the industry and find its been done incorrectly for years and no one is brave enough or looking at it closely enough to say anything.

Hi capguy4086,

Good day! I'm Vik, I'm SnapMagic's CAD manager.

Thank you for your honest feedback!

I personally looked into this matter along with our senior engineers. I agree, rounded rectangle pads are more preferable especially for lead-free soldering. We have applied this to our standard packages such as QFN, QFP, SON, SOP and SOIC.

Indeed, most 2-pad chip packages didn't have the rounded rectangle pads as a default shape. We are now working on applying modifications to ensure the newly generated chip packages have rounded rectangle pads. We also updated our internal creation process to ensure a corner radius is applied to the pads.

Thank you so much for sharing all these insights, it definitely helps us in making sure we provide you with the best CAD models! :)