2-2013290-1
Conn DDR3 SO DIMM SKT 204 POS 0.6mm Solder RA SMD Embossed T/R
Availability: In Stock
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Verification | Issues | Specs | Pricing |
Specifications for the 2-2013290-1
Part Name | 2-2013290-1 |
Manufacturer | TE Connectivity |
Centerline (Pitch) | .024 |
Keying | Reverse |
Circuit Application | Power |
Ejector Location | Both Ends |
Housing Material | High Temperature Thermoplastic |
Connector & Contact Terminates To | Printed Circuit Board |
PCB Mount Retention Type | Solder Peg |
Profile | Reverse |
PCB Mount Retention | With |
Stack Height | .205 |
Latch Plating Material | Tin |
Center Key | Offset Right |
TE Internal Number | 2-2013290-1 |
Number of Positions | 204 |
Connector System | Cable-to-Board |
Ejector Type | Locking |
Housing Color | Black |
Insertion Style | Cam-In |
Contact Base Material | Copper Alloy |
Connector Mounting Type | Board Mount |
Number of Bays | 2 |
Number of Keys | 1 |
Operating Temperature Range | -55 – 85 |
Packaging Method | Emboss on Reel |
Packaging Quantity | 200 |
DRAM Type | Double Data Rate (DDR) 3 |
Contact Mating Area Plating Material | Gold Flash |
Socket Style | SO DIMM |
Module Key Type | SGRAM |
PCB Mounting Style | Surface Mount |
Product Type | Socket |
Module Orientation | Right Angle |
SGRAM Voltage (V) | 1.5 |
Socket Type | Memory Card |
UL Flammability Rating | UL 94V-0 |
Latch Material | Stainless Steel |
Row-to-Row Spacing | 8.2 |
Contact Current Rating (Max) (A) | .5 |
DRAM Voltage (V) | 1.5 |
列数 | 2 |
PCB Contact Termination Area Plating Material | Gold |
Sealable | No |
Formats Available for Symbols and Footprints |
Altium, Eagle, KiCAD, Cadence OrCad/Allegro, PADS, DxDesigner, PCB123, Pulsonix, Proteus |
Datasheet | See Datasheet PDF |
Inventory for the 2-2013290-1 by TE Connectivity AMP Connectors from major distributors.
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