

66103-1
Connector PIN 20-24 AWG 30 Gold Crimp Multimate III Series | TE Connectivity 66103-1
Availability: In Stock
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Verification | Issues | Specs | Pricing |
Specifications for the 66103-1
Part Name | 66103-1 |
Manufacturer | TE Connectivity |
Category | Connectors |
Underplate Material Thickness | 1.27 |
Circuit Application | Power & Signal |
Wire/Cable Type | Discrete Wire |
For Use With | M Series Connectors |
Connector & Contact Terminates To | Wire & Cable |
Test Current (A) | 13 |
TE Internal Number | 66103-1 |
Contact Underplating Material | Nickel |
Product Type | Contact |
Wire Insulation Support | With |
Contact Size | 16 |
Operating Temperature Range | -55 – 150 |
Packaging Method | Loose Piece |
Packaging Quantity | 1000 |
Contact Base Material | Brass |
Contact Termination Area Plating Material | Gold |
Accepts Wire Insulation Diameter Range | 1.02 – 2.03 |
Contact Mating Area Plating Material | Precious Metal |
端子の下地めっきの材料 | Nickel |
Contact Current Rating (Max) (A) | 13 |
Contact Mating Area Plating Thickness | 30 |
Termination Type | Crimp |
Mating Pin Diameter | 1.57 |
Contact Type | Pin |
Contact Termination Area Plating Thickness | 10 |
Wire Size | 24 – 20 |
Formats Available for Symbols and Footprints |
Altium, Eagle, KiCAD, Cadence OrCad/Allegro, PADS, DxDesigner, PCB123, Pulsonix, Proteus |
Datasheet | See Datasheet PDF |
Series | Type III+ |
Minimum Wire Size (Mm²) | 0.2 (mm²) |
Minimum Wire Size (Awg) | 24 (AWG) |
Termination Method | Crimp |
Maximum Wire Size (Mm²) | 0.6 (mm²) |
Maximum Wire Size (Awg) | 20 (AWG) |
Contact Plating | Gold |
Gender | Male |
For Use With | CPC, G Series and M Series Connector Housings |
Contact Material | Brass |
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