2227MC080318F1
SOCKET IC, DIL, 0.3", 8WAY; No. of Contacts:8Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:2227MC Series; Row Pitch:7.62mm; Contact Material:Phosphor Bronze; Contact Plating:Tin Plated Contacts; SVHC:No SVHC (15-Jan-2019); Connector Mounting Orientation:PC Board; Contact Termination:Through Hole Vertical; Contact Termination Type:Through Hole; External Depth:7.4mm; External Length / Height:10.16mm; External Width:10.16mm; Insulation Resistance:1000Mohm; Lead Spacing:2.54mm; Operating Temperature Max:125°C; Operating Temperature Min:-55°C; Pin Format:DIP; Tube Quantity:1
Availability: Out of Stock
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Specifications for the 2227MC080318F1
Part Name | 2227MC080318F1 |
Manufacturer | Multicomp Pro |
Formats Available for Symbols and Footprints |
Altium, Eagle, KiCAD, Cadence OrCad/Allegro, PADS, DxDesigner, PCB123, Pulsonix, Proteus |
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